论文部分内容阅读
采用电化学沉积的方法制备了类似“糖葫芦”结构铜短碳纤维复合增强体,并采用SEM,XPS,DSC等分析测试技术对其形貌及表面特征进行表征,进而分析球状铜层的形成机制。实验中首先将短碳纤维在450℃下煅烧1h,然后将其均匀分散在镀液中(50g.L-1CuSO4.5H2O+10.gL-1酒石酸钠+90.gL-1柠檬酸钠+12.gL-1KNO3),调节不同电压,得到“糖葫芦状”铜短碳纤维复合增强体。经过分析,煅烧处理后的碳纤维表面O元素含量增加,即含氧基团-OH和C=O含量升高,这些官能团使得纤维表面的活性增加。对于电镀铜来说,外加沉积电位以及活性基团自身与镀液中Cu2+反应的共同作用才是氧化还原反应的驱动力,当外加电位较低时,只有具有活性基团的位置才能发生反应沉积出铜,其他位置由于不能满足反应所需的最小驱动力而不能反应,因此形成“糖葫芦”结构。当电位增大,活性官能团的促进作用逐渐不明显,由沉积电压控制的初始形核过程占主导地位,发生均匀形核过程,表面获得均匀光滑沉积层。因此,通过控制沉积电压可以得到“糖葫芦”结构铜短碳纤维复合丝,此结构的临界电压为0.9V,电镀时间为0.5h。
Electrochemical deposition was used to prepare the similar “hyacinth” structural copper short carbon fiber composite reinforcements. The morphology and surface characteristics were characterized by SEM, XPS and DSC, and then the formation of spherical copper layer mechanism. In the experiment, the short carbon fiber was first calcined at 450 ° C for 1 hour and then uniformly dispersed in the plating solution (50g.L-1CuSO4.5H2O + 10.gL-1 sodium tartrate + 90.gL-1 sodium citrate +12). gL-1KNO3), adjust different voltage, get “candied fruit ” copper short carbon fiber composite reinforcements. After analysis, the content of O element on the surface of the carbon fiber after calcination increases, that is, the contents of -OH and C═O of the oxygen-containing groups increase, and these functional groups increase the activity of the fiber surface. For copper electroplating, the combined deposition potential and the interaction of the active groups themselves with the Cu2 + in the bath is the driving force for the redox reaction. Only when the applied potential is lower, only the sites with active groups can react and deposit Out of copper, the other positions can not react because they can not meet the minimum driving force required for the reaction, thus forming a “candied fruit” structure. When the potential increases, the promotion of active functional groups is not obvious. The initial nucleation controlled by deposition voltage dominates. The uniform nucleation takes place and a uniform and smooth deposition layer is obtained on the surface. Therefore, by controlling the deposition voltage can be “candied fruit ” structural copper short carbon fiber composite wire, the structure of the threshold voltage of 0.9V, plating time 0.5h.