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根据固体激光器抽运的技术要求,设计了一种具有水冷装置的大功率半导体激光器二维阵列模块,并对半导体激光器热沉和致冷系统的热流进行了分析。在不同占空比下,对该模块进行了测试与分析。该模块的中心波长为810 nm,光谱半峰全宽(FWHM)为2.5 nm,工作电流为110 A(200μs,10%占空比),循环水温为15℃时输出峰值功率为280 W。结果表明,该封装结构在占空比小于5%时器件工作特性良好,在10%占空比下也可正常工作。利用该模块可以组合成多种几何结构、功率更高的半导体激光器组件。
According to the technical requirement of solid-state laser pumping, a two-dimensional array module of high-power semiconductor laser with water-cooling device is designed and the heat flow of heat sink and refrigeration system of semiconductor laser is analyzed. Under different duty cycles, the module was tested and analyzed. The module has a center wavelength of 810 nm, a full width at half maximum (FWHM) of 2.5 nm, a working current of 110 A (200 μs, 10% duty cycle) and a peak output power of 280 W at a circulating water temperature of 15 ° C. The results show that the device has good working characteristics when the duty ratio is less than 5% and can work normally at 10% duty cycle. The module can be combined into a variety of geometric structure, higher power semiconductor laser components.