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对不同轧制加工率下所制备的纯银带材进行退火处理,分析不同加工率下纯银的再结晶温度和显微组织。结果表明:轧制加工率的大小直接影响纯银的再结晶温度。加工率越大,再结晶温度越低。当加工率为90%时,退火温度为100℃时纯银即发生再结晶转变,组织呈等轴晶;当加工率为10%时,退火温度增加至400℃时纯银才可发生完全再结晶。
Annealing the pure silver strips prepared under different rolling rates and analyzing the recrystallization temperature and microstructure of pure silver under different processing rates. The results show that the size of the rolling process directly affects the recrystallization temperature of pure silver. The greater the processing rate, the lower the recrystallization temperature. When the processing rate is 90%, the recrystallization of pure silver occurs when the annealing temperature is 100 ℃, and the structure is equiaxed. When the annealing temperature is increased to 400 ℃, the pure silver can be completely crystallization.