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在电真空器件封装中,银铜28焊料的流散性对器件的外观质量和可靠性有着重要影响。文章对不同电镀方式和镀层厚度对焊料流散性的影响进行了分析研究,结果表明在相同的钎焊制度下,镍层厚度在0.6 mm～2.1 mm范围内,银铜焊料在电镀镍上的流散性优于化学镀镍,同时,焊料的流散性随着电镍层厚度的增加,先增长后逐渐减小。在钎焊过程中,可以根据零件实际状态和产品要求,选择合适的镀镍方式和镍层厚度,以满足实际生产需求。
In electro-vacuum device packages, the dispersivity of silver-copper 28 solder has a significant impact on the appearance and reliability of the device. The influence of different electroplating methods and coating thickness on the fluidity of the solder is analyzed. The results show that the nickel layer thickness is in the range of 0.6 mm ~ 2.1 mm under the same brazing system. The dispersion of silver-copper solder on the nickel plating The property is superior to the electroless nickel plating. At the same time, the fluidity of the solder first increases and then decreases with the increase of the thickness of the nickel electrode. In the brazing process, according to the actual state of parts and product requirements, choose the appropriate nickel plating and nickel layer thickness to meet the actual production needs.