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介绍了硅基高长径比微孔列阵形成的多路感应耦合等离子体刻蚀和电化学刻蚀等半导体工艺技术,给出了实验系统、原理、方法和实验结果,指出了工艺中出现的新现象和亟待解决的新问题,阐述了其在二维通道电子倍增器-微通道板中的应用。
The semiconductor process technologies such as multi-channel inductively coupled plasma etching and electrochemical etching, which are formed by high aspect ratio microporous arrays, are introduced. The experimental system, principle, method and experimental results are given. The new phenomenon and the urgent need to be solved, expounds its application in two-dimensional channel electron multiplier - microchannel plate.