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我们用Rikelman方法估算了CO_2红外激光热扫描无损检测技术在电路板虚焊点检测中的经济效益。假设电路板中出现虚焊点的几率为N,用目检方法发现虚焊点的几率为P_1,返修一个虚焊点的费用为C_(r1),返修后再复检一个虚焊点的费用为C_(i1)全电路板检测费用为C_(io),则,总费用为 C_(dl)=NP_1(C_(r1)+C_(i1))+C_(io)。利用热扫描红外检测方法对电路板焊接过程中进行监测,发现虚焊点随时返修,基本上不用返修费用。这一工艺的费用为
We use the Rikelman method to estimate the economic benefits of CO_2 infrared laser scanning non-destructive testing technology in the detection of virtual solder joints on the circuit board. Assuming that the probability of occurrence of a virtual solder joint in a circuit board is N, the probability of finding a virtual welding joint with a visual inspection method is P_1, the cost of repairing a virtual welding joint is C_ (r1), and reworking a virtual welding joint after rework For C_ (i1) full circuit board detection cost C_ (io), then the total cost of C_ (dl) = NP_1 (C_ (r1) + C_ (i1)) + C_ (io). The use of thermal scanning infrared detection method to monitor the circuit board welding process, found that Weld repair at any time, basically no need to rework costs. The cost of this process is