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随着半导体业逐渐地走出2008/2009年低谷,450 mm硅片的可行性再次提上议事日程。目前450 mm最大问题集中在研发成本及未来投资的回报率。
As the semiconductor industry gradually out of the 2008/2009 low, the feasibility of 450 mm silicon again put on the agenda. The current 450 mm biggest problem is the R & D cost and future investment return.