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针对Ag-Cu-In-Sn系钎料传统制备方法具有因熔炼、凝固产生大量脆性相,导致后续成形加工难以进行的瓶颈问题,提出了电磁压制制备的新思路。采用理论分析、工艺试验、显微分析等手段对电磁压制成形的BAg58Cu22In10Sn10银基钎料进行研究。结果表明:在一定的烧结温度范围内,烧结温度越高烧结后试样致密度越大,硬度越高;钎焊温度不变时,在一定的烧结温度范围内,烧结温度越高,试样润湿铺展面积越大。烧结温度不变时,在一定的钎焊温度范围内,钎焊温度越高,试样润湿铺展面积先增大后减少。该结果为无镉中温银基钎料的电磁压制成形工艺提供了一定的理论和工程实践指导。
The traditional preparation method of Ag-Cu-In-Sn brazing filler metal has a lot of brittle phases due to melting and solidification, leading to the bottleneck that is difficult to be formed by subsequent forming processes. A new idea of electromagnetic pressing is proposed. Theoretical analysis, process test, microscopic analysis and other means of electromagnetic pressing forming BAg58Cu22In10Sn10 silver-based solder. The results show that the higher the sintering temperature is, the higher the sintering density is and the higher the hardness is. When the brazing temperature is constant, the sintering temperature is higher in a certain sintering temperature range. The sample Moisturizing spreading the greater the area. Sintering temperature is constant, within a certain range of brazing temperature, the higher the brazing temperature, the sample wetting spread area first increased and then decreased. The results provide a theoretical and practical guidance for the electromagnetic pressing forming process of cadmium-free medium temperature silver-based solder.