介绍了硅基内埋置有源芯片多层布线工艺、低温共烧陶瓷(LTCC)基板工艺、芯片叠层装配等高密度系统级封装技术,重点介绍了系统级封装技术的总体结构设计、主要工艺流程、三维层叠互连的关键工艺技术,以及系统测试和检测评价等技术。 This paper introduces high-density system-in-package (SOC) packaging technology such as multi-layer wiring technology for embedded active silicon in silicon substrate, LTCC substrate technology and chip stack assembly, and focuses on the overall structure design of system-in-package technology Process flow, three-dimensional laminated interconnection of the key process technology, and system testing and testing and evaluation techniques.