绕接技术的原理和应用

来源 :电子计算机动态 | 被引量 : 0次 | 上传用户:assembly2010
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小引由于电子工业的飞速发展和技术上的进步,需要更快的、更为可靠的和更为经济的电气连接方法。特别在计算机事业中,这种必要性尤为显著。在过去,由于接点之间有充分的空间和相对说来连接点数量较少,绝大多数连接点,用锡焊并配合少数其它压力连接等就足可应付。但今日的电子设备十分复杂,尤其在电子计算机中,接点的数量多,而缩减设备容积的小型化要求,使连接任务更为艰巨,其结果要求在极小的空间内安排极为密集的接点,接点的数量往往以亿计,而且可靠性要求也更为严格,往往在10~(-7)以内。 Small lead due to the rapid development of the electronics industry and technological advances, the need for faster, more reliable and more economical electrical connection method. Especially in the computer industry, this necessity is particularly significant. In the past, due to the sufficient space between the contacts and the relatively small number of connection points, the vast majority of connection points were soldered with soldering and with a few other pressure connections. However, today’s electronic equipment is very complicated. Especially in electronic computers, the number of contacts is large and the miniaturization of equipment volume is reduced, making the connection task even more arduous. As a result, extremely dense contacts are required in a very small space, The number of contacts is often in billions, and the reliability requirements are also more stringent, often within 10 ~ (-7).
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