利用交流阻抗(EIS)和极化曲线 ,结合扫描电镜 (SEM)和能谱分析 ,对常温下低碳钢在含H2 S的模拟炼厂常减压塔顶冷凝水中的腐蚀电化学行为和不同浸泡时间下硫化物膜的生长过程进行了研究。结果表明 ,H2 S对腐蚀反应的阴极过程有很大的促进作用 ,搅拌条件下尤甚 ;随介质pH值升高 ,其腐蚀性减弱。腐蚀浸泡初期 (小于 8h) ,电极表面硫化物膜的生长遵循抛物线机制 ,随浸泡时间的延长 ,硫化物膜变得疏松、易于破裂和脱落 ,并出现二次生长、修复过程 ,最终达到膜生长和溶解的平衡。实验条件下电极表面所生成的硫化物膜 ,不足以对碳钢起到保护作用 Using electrochemical impedance spectroscopy (EIS) and polarization curves, combined with scanning electron microscopy (SEM) and energy spectrum analysis, the electrochemical behaviors of low carbon steel in condensate at atmospheric and vacuum condensate containing H2S Sulfide film growth process under immersion time was studied. The results show that H2S can greatly promote the cathodic process of corrosion reaction, especially under the stirring conditions. The corrosion of H2S decreases with the increase of pH. In the initial period of corrosion immersion (less than 8h), the growth of sulfide film on the electrode surface follows the parabola mechanism. With the extension of immersion time, the sulfide film becomes loose, easily ruptures and falls off, and appears secondary growth and repair process, finally reaching the film growth And dissolve the balance. Under the experimental conditions, the sulfide film formed on the electrode surface is not enough to protect the carbon steel