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据《电子测试》2004年第4期报道,杰尔系统(Agere Sytems)近日宣布:推出五款高性能的RF超模压塑封装晶体管,将使封装成本下降25%,杰尔的解决方案不仅能降低基站的整体成本,而且还可加快无线基站放大器设备的规模布局。
Agere Sytems today announced that the launch of five high-performance RF overmolded plastic packaged transistors will result in a 25% reduction in packaging costs, and Agere’s solution will not only enable Reduce the overall cost of the base station, but also speed up the scale layout of the wireless base station amplifier equipment.