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通过对ALL—BOND2粘结材料处理的窝洞内壁与银汞充填物间的密合情况进行观察,以评价其在充填治疗中的意义。应用染料渗入法和扫描电镜技术。结果表明,实验组充填体边缘微漏率明显低于洞壁未加处理的对照组(P<0.01)。结论:ALL—BOND粘结材料能够明显改善充填体边缘微漏。
Through the ALL-BOND2 adhesive treatment of the wall cavity and amalgam filling between the close observation to evaluate its significance in the filling treatment. Application of dye penetration and scanning electron microscopy. The results showed that the marginal leakage rate of the filling group was significantly lower than that of the untreated control group (P <0.01). Conclusion: ALL-BOND bonding material can significantly improve the leakage margin of the filling body.