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采用扫描电镜(SEM)和激光粒度分析仪研究了无铅焊锡粉末Sn3Ag2.8Cu和Sn3Ag2.8Cu-0.1Ce的特性诸如球形度、粒度分布、润湿性及钎焊接头的显微组织,并与对应合金的润湿性及钎焊接头显微组织进行了对比。结果表明:Sn3Ag2.8Cu和Sn3Ag2.8Cu-0.1Ce粉末都具有较好的粒度分布和球形度;与传统Sn37Pb粉末和Sn3Ag2.8Cu粉末相比,Sn3Ag2.8Cu-0.1Ce粉末均具有更好的润湿性;在与铜基板的钎焊中,Sn3Ag2.8Cu-0.1Ce粉末的扩散层比Sn3Ag2.8Cu粉末更薄,但两种粉末与铜基板形成的扩散层均比其对应合金与铜基板的扩散层更厚。因此,Sn3Ag2.8Cu-0.1Ce粉末具有更好的综合性能。
The properties of Sn3Ag2.8Cu and Sn3Ag2.8Cu-0.1Ce, such as sphericity, particle size distribution, wettability and microstructure of brazed joints, were investigated by scanning electron microscope (SEM) and laser particle size analyzer. Corresponding to the wettability of the alloy and brazed joints were compared microstructure. The results show that both Sn3Ag2.8Cu and Sn3Ag2.8Cu-0.1Ce powders have better particle size distribution and sphericity. Compared with Sn37Pb powder and Sn3Ag2.8Cu powder, Sn3Ag2.8Cu-0.1Ce powders have better Mo Wettability; Sn3Ag2.8Cu-0.1Ce powder diffusion layer than the Sn3Ag2.8Cu powder thinner in the brazing with the copper substrate, but the two kinds of powder and the copper substrate diffusion layer than its corresponding alloy and copper substrate Thicker diffusion layer. Therefore, Sn3Ag2.8Cu-0.1Ce powder has better overall performance.