As an emerging assembly technique to transfer micro/nano-objects (i.e.inks) from donor substrate to receiver substrate using soft polymeric stamps,transfer printing has become increasingly popular in the last decade due to its unique capability of integrating diverse materials in various structural layouts.A growing number of applications are enabled by transfer printing,particular advanced flexible and stretchable electronic systems requiring heterogeneous integration of inorganic materials on plastic or rubber substrates [1].The critical challenge for efficient transfer printing is to manipulate the stamp/ink interfacial adhesion between strong state for picking and weak state for printing in a rapid,repeatable,and robust manner.The kinetic approach that exploits rate-dependent viscosity effect through peeling velocity is very useful,but the adhesion switchability is low with the minimum adhesion usually larger than desired.Several other strategies that can complement or be combined with that based on rate have been demonstrated such as surface relief-assisted transfer printing [2] and magnetic-controlled transfer printing [3].The recently developed laser-driven transfer printing [4] based on interracial thermal mismatch eliminates the influence of receiver and allows non-contact printing of inks onto arbitrary receivers.However,the induced undesired high temperature usually larger than 200℃ causes interfacial damages and greatly limits its broad utility.