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在无溶剂条件下利用烷氧基硅烷合成了有机硅低聚物,用聚酯多元醇对其进行了改性。采用红外光谱对低聚物和预聚体进行了表征。在此基础上研究了不同合成路线所构体系的粘接性能、力学性能,同时用TG对其耐热性进行了考察,结果表明路线一的耐热性较好,在680℃下失重为66．1％。
Silicone oligomers were synthesized in the absence of solvents using alkoxysilanes, which were modified with polyester polyols. The oligomers and prepolymers were characterized by infrared spectroscopy. On the basis of this study, the adhesive properties and mechanical properties of the systems with different synthetic routes were studied. The heat resistance of the system was also investigated by TG. The results showed that the heat resistance of Route 1 is better, and the weight loss at 680 ℃ is 66 .1%.