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上海仪表胶木厂研制的先进的快速电铸工艺,经过两年努力取得成功,年前通过了技术鉴定。快速电铸工艺是上海市科委1983年下达的“重大科学技术研究项目”之一,并列入了国家经委拟定的《国家科技攻关项目》。该项目的各项技术指标都达到了快速电铸技术的要求。以径深比为1的深铸件 KYZ—50～65施钮为例,电铸周期由原来的28天缩短到4～7天。沉积层厚度为5毫米,最快沉积速率达到0.2毫米/小时,电铸层硬度可控制在 HV200
Shanghai instrument bakelite developed advanced rapid electroforming process, after two years of hard work to success, passed the technical appraisal years ago. Rapid electroforming technology is one of the “major science and technology research projects” issued by Shanghai Municipal Science and Technology Commission in 1983 and included in the “National Science and Technology Research Project” formulated by the State Economic Commission. The project’s technical indicators have reached the requirements of rapid electroforming technology. For example, the casting depth of KYZ-50 ~ 65 with a depth-to-depth ratio of 1 is shortened from 28 days to 4 to 7 days. Sediment thickness of 5 mm, the fastest deposition rate of 0.2 mm / h, the hardness of the electroformed layer can be controlled at HV200