据有关报道,IMEC公司现已开发出用于圆片级封装的新技术。这种新技术通过在已制作有图形的圆片上应用感应膜,使Q因数达到了30。另外,与Gu布线、AV布线等的后端工艺相适应,对下层布线在性能上据说是没有什么影响。现行的片上因数虽然已达到了5～10左右的低Q因数,然而,在面向Si基的RF/微波IC中,它作为一个课题还没有得 According to reports, IMEC has now developed a new technology for wafer-level packaging. This new technology brings the Q factor to 30 by applying a sensing film to a wafer that has been patterned. In addition, with Gu wiring, AV cabling and other back-end technology to adapt to the lower wiring in the performance is said to have no effect. Although the current on-chip factor has reached a low Q factor of about 5 to 10, however, it has not been available as a subject in RF / microwave ICs for Si-based