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在解决微电子装配和元件制造中存在的问题时,载带微互连技术已经越来越富有吸引力。目前,群焊设备和系统已取得的进展,可用来解决微装配中的许多难题。本文敍述了从实验室,小批生产直到大量生产各级应用的焊接工具和设备系统。
Carrier tape micro-interconnect technology has become increasingly attractive in addressing the problems in microelectronic assembly and component fabrication. At present, the progress made in the field of welding equipment and systems can be used to solve many of the challenges in microassembly. This article describes the welding tools and equipment systems from the laboratory, small batch production to mass production of all levels of application.