电子装置需要的高硬度耐用氮化金材料已经由英国NewcastleUponTyne大学开发研制出来,因此这种材料比目前使用的金合金更硬更耐用,可以用更薄的一层镀敷在产品上面,降低了加工成本。氮化金材料采用离子植入工艺技术,金被放入超高真空室里,用氩气清洗后加热,然后用溅射枪注入氮离 Developed by NewcastleUponTyne University in the United Kingdom, the high-hardness, durable nitride material required for electronic devices is harder and more durable than the currently used gold alloys and can be applied to the product in a thinner layer to reduce the Processing costs. Gold nitride material using ion implantation technology, gold was placed in the ultra-high vacuum chamber, heated with argon purge, and then use a sputtering gun into the nitrogen