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经过长时间的酝酿和研究之后,热压花、注塑成型的内连元件(MID)正逐步在电子产品制造业领域获得推广和应用。回顾1999年,最初加工这种电子元件的企业是德国克劳斯·玛菲公司,当时是在一套1+1的型腔模具上,利用30%玻纤增强PA66材料在注塑机上同时进行注塑和压花,加工出一种传感?
After a long period of deliberation and research, hot embossing and injection molding of interconnected components (MIDs) are gradually being promoted and applied in the field of electronic product manufacturing. Recall that in 1999 the original manufacturer of such electronic components was Klaus Maffei of Germany, which was on a 1 + 1 cavity mold at the same time using a 30% glass-reinforced PA66 material on an injection molding machine Injection and embossing, processing out a sense?