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三维网状石墨烯/环氧树脂热界面复合材料由于具有良好的热导性能和力学性能,而被广泛应用于微电子器件领域。但是通过化学剥离-还原法制备石墨烯,在填加石墨烯质量分数相同的条件下,石墨烯/环氧树脂热界面复合材料的热导率差别仍然很大。研究发现这主要是由于石墨烯表面官能团含量不同所导致的,因此很难建立统一的标准评估石墨烯作为导热填料的作用效果。为了避免表面官能团对石墨烯/环氧树脂复合物热导率的影响,本研究小组采用化学气相沉积法制备的三维网状石墨烯作为导热填料,对环氧树脂进行修饰,制备了一系列石墨烯/环氧树脂材料。通过研究三维网状石墨烯含量对石墨烯/环氧树脂材料热导率、力学性能及热导率在高温条件下稳定性的影响,有助于完善石墨烯修饰的环氧树脂热界面复合材料的研究,并建立石墨烯作为导热填料的评价体系。
Three-dimensional network graphene / epoxy thermal interface composites are widely used in the field of microelectronic devices because of their good thermal conductivity and mechanical properties. However, the graphene / epoxy resin thermal interface composites with the same mass fraction of graphene still have a large difference in thermal conductivity when prepared by chemical stripping-reduction method. It is found that this is mainly due to the different functional groups on the surface of graphene. Therefore, it is very difficult to establish a uniform standard to evaluate the effect of graphene as a heat-conducting filler. In order to avoid the influence of surface functional groups on the thermal conductivity of graphene / epoxy composites, the research team used the three-dimensional network graphene prepared by chemical vapor deposition as a thermal conductive filler to modify the epoxy resin to prepare a series of graphite Olefin / epoxy material. The effect of the three-dimensional network graphene content on the thermal conductivity, mechanical properties and thermal conductivity of graphene / epoxy resin materials under high temperature is helpful to improve the thermal stability of graphene modified epoxy resin thermal interface composites Of the research, and the establishment of graphene as a thermal conductive filler evaluation system.