近来,混合集成电路把电阻、电容、晶体管等分立元件以及数字电路、运算放大器等集成电路、大规模集成电路组装起来构成功能器件,它能在很大范围内与新系统的设计相适应。由于混合集成电路的特点,它正在被广泛地应用于要求小型化,高可靠、高功率等场合,从玩具到通信设备、信息处理设备、直至宇宙通信。混合集成电路是作为要求降低材料赞用,组装费用和设计费用等系统总成本的分系统组装技术而发展起来的。 Recently, hybrid integrated circuits have integrated circuits such as resistors, capacitors, transistors and other discrete components as well as digital circuits, operational amplifiers, and large-scale integrated circuits to form functional devices that can be adapted to the design of the new system to a large extent. Due to the characteristics of hybrid integrated circuits, it is being widely used in applications requiring miniaturization, high reliability, high power and the like, from toys to communication equipment, information processing equipment, and communication to the universe. Hybrid integrated circuits are being developed as subsystem assembly techniques that require a reduction in the total system cost of materials, assembly costs, and design costs.