据《中国电子报》报导,推动全球半导体工业不断进步的两个轮子,一个是特征尺寸不断缩小,另一个是硅片直径不断增大,目前全球12英寸芯片生产线正稳步发展。特征尺寸缩小硅片尺寸增大在正常情况下总是将缩小特征尺寸放在首位,因为除了光刻工艺变更外,其余的相对变化不大,从成本结 According to the “China Electronics News” reported that to promote the continuous progress of the global semiconductor industry two wheels, one is feature size is shrinking, the other is the growing diameter of silicon, the current global 12-inch chip production line is steadily developing. Reduced feature size Increasing the size of the wafer will always reduce the feature size in the first place, as the rest of the changes will not change much except for the lithography process,