一、问题的提出随着电子工业的发展,电子产品的集成度愈来愈高,要求产品的结构愈来愈密集、紧凑。要实现这一要求,对采用多种微波器件的分机来说,确有一定的困难。通常的微波器件都是由其本身的插头座来进行相互联接的。由于接插件本身的体积和装拆接插件所需要的空间,使得这些微波器件之间必须留有足够的空位,加上这些微波器件大 First, the question raised With the development of the electronics industry, the higher the level of integration of electronic products, the product structure requires increasingly dense and compact. To achieve this requirement, the use of a variety of microwave devices extension, there are indeed some difficulties. The usual microwave devices are interconnected by their own plug base. Due to the size of the connector itself and the space required for mounting and dismounting the connector, sufficient space must be left between these microwave devices. In addition, these microwave devices are large