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在研制制冷型红外探测器组件的过程中,降低功能模块的热应力是设计及制造的核心目标之一,这要求首先能够对焦平面模块的热应力进行测量表征,工程上一般通过形变等间接量来表征碲镉汞的热应力。基于此研究了激光干涉法测量制冷型红外焦平面探测器的表面形变并对其误差进行了分析,该方法克服了常规的台阶仪测量方法所固有的温度控制不够理想、测试过程中样品表面有结霜等困难,它利用相干光在标准镜上干涉形成的干涉图样来反映样品表面的形变。试验表明:该方法可以进行实时变温的表面形变测量,为制冷型红外焦平面组件的封装设计提供可靠的形变测试数据,实现了焦平面模块在封装杜瓦内的表面形变的低温在线测量。
Reducing the thermal stress of the functional module is one of the core design and manufacturing goals in the development of the COB module. This requires that the thermal stress of the Focal Plane Module can be first measured and characterized. In engineering, To characterize the thermal stress of HgCdTe. Based on this, the laser interferometry is used to measure the surface distortion of the infrared detector and the error is analyzed. The method overcomes the problem that the temperature control inherent in conventional measurement methods is not ideal. The surface of the sample Frost and other difficulties, it uses the interference of coherent light in the standard mirror interference pattern to reflect the sample surface deformation. The experimental results show that the method can provide real-time temperature deformation measurement, provide reliable deformation test data for the package design of the infrared focal plane assembly, and realize the online measurement of the surface deformation of the focal plane module in the package Dewar.