随着单片微波集成电路工艺的发展,尽管互连技术在发展过程中已经落后,但高密度电子学却仍然集中在传统的芯片水平上。在新型封装方法中,把一些固化的陶瓷重叠在一起并烧结成一块多层衬底,这样可以大大地增加互连密度。这项工艺可以简化封装设计而且可以改善可靠性。 With the development of monolithic microwave integrated circuit technology, although the interconnection technology has lagged behind in the development process, high-density electronics are still focused on the traditional chip level. In the new packaging method, some of the cured ceramics are stacked together and sintered into a multilayer substrate, which can greatly increase the interconnect density. This process simplifies package design and improves reliability.