论文部分内容阅读
在半导体的激光微细加工技术里 ,微小曝光区域的温度分布是关键的工艺参数 ,必须得到精确的测量。而为了使温度测量不影响曝光区的温度分布 ,需采用不接触测量方法。研制了计算机温度测量系统 ,实现了微小激光曝光区温度的实时不接触测量。系统中 ,InGaAs/InP光探测器将微小高温区的温度信号转换为光电流 ,再经信号放大及模 /数转换后输入计算机。结合温度定标实验 ,对测得的温度数据进行插值运算 ,在实验中可以实时显示出曝光区的温度值。系统的温度分辨率可达到 0 .2℃ ,测量区域的最小直径可达到 18μm。同时设计了搜索算法 ,使温度数据采集和精密位移平台的移动相配合 ,实现了温度分布的测量和最高温度区的准确定位
In semiconductor laser micromachining technology, the temperature distribution in the micro-exposure area is a key process parameter and must be accurately measured. In order to make the temperature measurement does not affect the temperature distribution of the exposed area, the need to use non-contact measurement method. Developed a computer temperature measurement system to achieve real-time non-contact measurement of the temperature of the tiny laser exposure zone. In the system, the InGaAs / InP photodetector converts the temperature signal of the small high temperature region into photocurrent, and then enters the computer through signal amplification and A / D conversion. Combined with temperature calibration experiment, the measured temperature data are interpolated and the temperature in exposed area can be displayed in real time in experiment. System temperature resolution can reach 0.2 ℃, the minimum diameter of the measurement area can reach 18μm. At the same time, a search algorithm is designed to match the temperature data acquisition and the movement of the precision displacement platform to achieve the measurement of the temperature distribution and the accurate positioning of the highest temperature region