针对化学机械抛光装备中晶圆位置变化时传输机器人无法有效进行抓取的问题,提出了一种化学机械抛光传输机器人晶圆抓取自适应控制方法.机械手在对化学机械抛光设备工位上晶圆进行抓取时,使用先进的红外传感器测量晶圆位置和偏差,并进行实时位置补偿,从而实现机械手对工位上晶圆抓取的自适应能力,提高了化学机械抛光装备效率和可靠性.仿真实验验证了系统的有效性. Aiming at the problem that the transfer robot can not effectively grasp the position of the wafer in the chemical mechanical polishing equipment, a chemical wafer transfer control method is proposed for chemical mechanical polishing transfer robot. When the circle is taken, the advanced infrared sensor is used to measure the position and deviation of the wafer and perform real-time position compensation so that the manipulator can adaptively grasp the wafer on the station and improve the efficiency and reliability of the chemical mechanical polishing equipment Simulation results show the effectiveness of the system.