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采用飞秒激光微加工系统对宽带隙陶瓷材料SiC和Al2O3诱导微结构时的去除机理及烧蚀特性进行了研究。应用扫描电子显微镜、粗糙度轮廓仪、光学显微镜和能量色散谱仪等对烧蚀的微观形貌和化学组成进行了评价,得出加工SiC时强烧蚀和轻烧蚀的破坏阈值分别为0.61 J/cm2和0.13 J/cm2。同时获得了加工参数与烧蚀形貌之间的关系,发现材料的去除机理强烈依赖于入射激光的脉冲能量,并对二者的关联机制进行了分析。探讨了表面粗糙度和掺杂在材料中的不同元素对烧蚀结果的影响。从而为在难加工类宽带隙陶瓷材料表面加工高质量的微结构提供了有力的理论依据和技术支持。
Femtosecond laser micromachining system was used to study the removal mechanism and ablation characteristics of SiC and Al2O3-induced microstructure of wide bandgap ceramics. The morphology and chemical composition of ablation were evaluated by scanning electron microscope, roughness profiler, optical microscope and energy dispersive spectrometer. The results showed that the damage thresholds of ablation and light ablation were respectively 0.61 J / cm2 and 0.13 J / cm2. At the same time, the relationship between the processing parameters and the ablation morphology was obtained. It was found that the removal mechanism of the material strongly depends on the impulse energy of the incident laser and the correlation mechanism between the two is also analyzed. The effects of surface roughness and different elements doped in the material on the ablation results were discussed. This provides a powerful theoretical basis and technical support for processing high-quality microstructures on the surface of wide-bandgap ceramic materials with difficult processing.