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介绍了倒焊器件填充工艺原理,分析了胶水粘度、放置时间、填充温度和填充速度对填充效果的影响。在常温条件下,选用的胶水放置时间不超过1h,填充速度为0.20mg/min时,FPA(焦平面阵列)探测器有效区域的填充率达到100%,测试合格率大于95%。
The paper introduces the principle of filling device, analyzes the effect of glue viscosity, placement time, filling temperature and filling speed on filling effect. At room temperature, the selected glue is placed for less than 1 h at a fill speed of 0.20 mg / min. The fill rate of the effective area of the FPA detector reaches 100% and the test pass rate is greater than 95%.