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聚酰亚胺(Polyimide,PI)膜是一种新型的有机膜,具有耐高温、耐强酸和耐辐射等特性,用其制备的重离子微孔膜可以用于电池隔膜和放射性废气过滤等特殊领域。应用中国原子能科学研究院HI-13串列加速器产生的重离子束32S离子轰击25?m的PI薄膜,再对薄膜进行化学蚀刻处理,使由重离子辐照损伤产生的径迹形成微孔。为改善微孔质量,在化学蚀刻前采用具有强氧化性溶液对PI膜进行预处理浸泡,系统分析了常温下采用高锰酸钾和双氧水两种溶液浸泡不同时间对PI膜化学蚀刻的影响。实验结果显示,预处理浸泡可明显加快PI膜的径迹蚀刻速率,缩短蚀刻时间,减小微孔的锥角和提高PI重离子微孔膜的蚀刻质量。
Polyimide (PI) film is a new type of organic film with high temperature resistance, strong acid and radiation resistance and other characteristics, with its preparation of heavy ion microporous membrane can be used for battery separator and radioactive waste gas filtration and other special field. Heavy ion beams generated by the HI-13 tandem accelerator produced by the China Institute of Atomic Energy bombard the PI films with a thickness of 25 μm and then chemically etch the films to form micropores on tracks formed by heavy ion irradiation damage. In order to improve the micropore quality, PI films were pre-soaked with strong oxidizing solution prior to chemical etching. The effects of different solutions of potassium permanganate and hydrogen peroxide solution on the chemical etching of PI films at different temperatures were systematically analyzed. The experimental results show that the pretreatment immersion can obviously accelerate the track etching rate of PI film, shorten the etching time, reduce the taper angle and improve the etching quality of PI heavy ion microporous membrane.