论文部分内容阅读
安森美半导体计划推出先进硅锗 (SiGe)芯片系列 ,以满足网络设备制造商对设计OC 192、10 0亿位以太网 ( 10 GbE)及更高速网络产品的高性能要求。该芯片能以 12Gbit/s的高速度传输数据 ,较现有产品快 3倍。硅锗是一种硅基材料 ,是标准互补金属氧化半导体 (CMO
ON Semiconductor plans to introduce a family of advanced silicon germanium (SiGe) silicon to meet the high performance requirements of network equipment manufacturers for designing OC 192, 10 billion Ethernet (10 GbE) and higher speed networking products. The chip to 12Gbit / s high-speed data transmission, three times faster than existing products. Silicon germanium is a silicon-based material that is a standard complementary metal oxide semiconductor (CMO)