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针对常规X射线残余应力测定法和美国X2 0 0 1应力仪测定方法存在的问题 ,提出了测定低原子序数材料内部三维应力的层析扫描方法 ,对装置和测定原理进行了讨论 ,设计出适合于层析扫描测定方法的计算机程序。根据提供的试验数据 ,能够对这类材料表面及内部任意一点进行全三维应力分析 ,计算应力及梯度和被测材料的晶面间距 ,并有一套计算的自我控制机制。
Aiming at the existing problems of the conventional X-ray residual stress measurement and the measurement method of the USA X2 0 0 1 stressor, a three-dimensional tomography method for the determination of internal three-dimensional stress in low atomic number materials is proposed. The device and the principle of measurement are discussed, Computer program for the chromatographic scanning method. Based on the experimental data provided, full three-dimensional stress analysis can be performed at any point on the surface and inside of such materials to calculate the stress and gradient and the interplanar distance between the tested materials and a set of calculated self-control mechanisms.