基于各向异性导电胶的板间垂直互连研究

来源 :固体电子学研究与进展 | 被引量 : 0次 | 上传用户:colinvin
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提出一种基于各向异性导电胶(ACA)的封装方法,即利用ACA实现介质基板之间垂直互连过渡。该方法与传统的锡铅焊料工艺相比,ACA板间互连工艺具有互连距离短、固化温度低、工艺流程简单、绿色环保等特点。测试结果表明,ACA在垂直互连过程中拥有良好的微波传输性能。在0.1~19.0GHz内,回波损耗小于-10dB,插入损耗小于1.5dB;在26~30GHz频段范围内,回波损耗小于-10dB,插入损耗小于3dB。测试结果与电磁仿真结果吻合。 A packaging method based on anisotropic conductive adhesive (ACA) is proposed, which uses ACA to realize vertical interconnection transition between dielectric substrates. Compared with the traditional tin-lead solder process, the method has the advantages of short interconnection distance, low curing temperature, simple process flow, environmental protection and the like. The test results show that ACA has good microwave transmission performance in vertical interconnection. The return loss is less than -10dB and the insertion loss is less than 1.5dB at 0.1-19.0GHz. The return loss is less than -10dB and the insertion loss is less than 3dB in the frequency range of 26-30GHz. The test results are consistent with the electromagnetic simulation results.
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