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日本迪思科(Disco)开发出了用于LED的蓝宝石底板芯片加工技术。该技术的特点是,在切割蓝宝石底板时可同时兼顾LED的质量及成品率。该公司称其为“蓝宝石底板的Stealth Dicing Process”。原来采用金刚石划片器切割蓝宝石底板的方法有赖于操作人员的技术水平,因此在质量稳定性及
Japan’s Disco has developed sapphire backplane chip processing technology for LEDs. The technology is characterized by cutting the sapphire backplane while taking into account the quality and yield of the LED. The company calls it “the Stealth Dicing Process for sapphire substrates.” The original method of cutting the sapphire floor using a diamond scribing machine depends on the technical level of the operator, so the quality and stability