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Interface microstructures of Cu-Ni-Si/Al-Mg-Si clad composite wires during isothermal annealing from 623 to 773 K were investigated.The composite wires were fabricated by a drawing process.The evolution of inter-metallic compounds(IMCs)was analyzed.A continuous IMCs layer forms only after annealing for 1 min,which may be due to more IMCs nucleation points generated by deep drawing process.IMCs consist of Al4Cu9,AlCu and A12Cu identified by energy-dispersive spectroscopy(EDS)and transmission electron microscopy(TEM).The growth activation energies of total IMCs,Al2Cu,AlCu and Al4Cu9,are 98.8,69.4,101.3 and 137.1 kJ?mol-1,respec-tively.The higher growth activation energy of Al4Cu9 results in the higher growth rate under high temperature.However,the average interdiffusion coefficient for each IMC calculated by Wagner method shows that interdiffu-sion in Al2Cu and AlCu is more active than that in Al4Cu9.The higher growth rate of Al4Cu9 may be caused by the long concentration range.