运用ANSYS12.0软件对W/Cu梯度材料进行热应力模拟分析,并对结构进行优化设计。结果表明,随着成分分布指数(p)的增加,最大热应力先减小后增大;在p=1.3,热流密度为30 MW/m2时,最大热应力值最小为180 MPa,与非梯度材料相比最大等效热应力降低79%;最优化的梯度层厚度大于3 mm,梯度层数4~6层,钨板的厚度1~3 mm。 The thermal stress simulation analysis of W / Cu gradient material was carried out by ANSYS12.0 software and the structure was optimized. The results show that the maximum thermal stress firstly decreases and then increases with the increasing of the component distribution index (p); at p = 1.3 and the heat flux density of 30 MW / m2, the minimum thermal stress value is 180 MPa, The material has a 79% reduction in maximum equivalent thermal stress; the optimal gradient layer thickness is greater than 3 mm, the gradient layer is 4-6 layers, and the tungsten plate thickness is 1-3 mm.