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探讨了用HCD法在玻璃基板上制备的Ti 43 .2 7%Ni形状记忆合金薄膜和经不同热处理后的组织结构。结果表明 ,当镀膜的基板温度较高时 ,所得的薄膜基本晶化 ,其组织为由马氏体、R相、母相和Ti2 Ni析出相等组成的多晶体。经热处理后 ,母相量增加 ,马氏体量减少 ,表明热处理使Ms 点下降。利用这一现象 ,可扩大记忆合金薄膜的使用温度范围。在由室温加热到 1 1 0℃的动态观察中发现 ,多晶体中的马氏体逐步缩小、消失 ,转变成母相、R相 ,表现出热弹性 ,并且伴随有Ti2 Ni相析出
The Ti 43.27% Ni shape memory alloy films prepared by HCD method on glass substrates and the structure of the films after heat treatment were investigated. The results show that when the substrate temperature is high, the obtained film is basically crystallized and its microstructure is composed of martensite, R phase, parent phase and Ti2Ni precipitates. After heat treatment, the amount of parent phase increased, the amount of martensite decreased, indicating that Ms decreased heat treatment. Use of this phenomenon, can expand the use of memory alloy film temperature range. In the dynamic observation from room temperature to 110 ℃, the martensite in the polycrystal gradually shrinks and disappears into the mother phase and the R phase, which shows the thermoelasticity accompanied by the precipitation of the Ti2Ni phase