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根据国际商业机器公司的报告,用激光加热和液体刻蚀剂结合,使通常用在微电子学部件和磁记录器中的陶瓷材料的快速和精密微型加工更为方便。用活性离子刻蚀技术需要几小时做的陶瓷加工,用激光增强刻蚀技术仅要几秒钟就可完成。在这种新的激光技术中,陶瓷是浸在刻蚀剂(如氢氧化钾)中,将氩激光聚焦到直径10～50微米的斑点上扫描样品。当用1～10兆瓦/厘米~2的典型输出时,此种强激光束溶化陶瓷表面,刻蚀剂很快带走溶化的材料,留下一清洁的切口。迄今,新工艺的大量实验是用含70%的氧化铝和30%的碳化钛陶瓷。该公司把这种材料用于一些要求加工特别精确的沟槽和小孔(典型的为1密尔
According to International Business Machines Corp., the combination of laser heating and liquid etchant facilitates the rapid and precision micromachining of ceramic materials commonly used in microelectronic components and magnetic recorders. Using reactive ion etching requires several hours of ceramic processing, and laser-enhanced etching takes only seconds to complete. In this new laser technology, the ceramic is immersed in an etchant such as potassium hydroxide and the argon laser is focused on a spot of 10 to 50 microns in diameter to scan the sample. When using a typical output of 1 to 10 MW / cm 2, such a strong laser beam dissolves the ceramic surface and the etchant quickly removes the dissolved material, leaving a clean cut. So far, a large number of experiments of the new process is to use 70% of alumina and 30% of titanium carbide ceramic. The company uses this material for some applications that require extremely precise grooves and holes (typically 1 mil