论文部分内容阅读
本文主要介绍了日本的各大半导体公司和安装公司均在争相开发一种与u1芯片尺寸几乎同等大小的小型管壳（CSP：chipsizepackage或ChipscalePackage）。其中一部分已开始出售样品，该管壳的面积与具有相同管脚数的QFP相比，只有其1／10那么大，而且也能做到多管脚化，这将对高速LSI的发展起到巨大的促进作用。特别是在以10o管脚～200管脚为发展目标的，正在研制生产携带电话机和照相机一体式VTR的公司中引起了极大兴趣。尽管在标准化、成本，安装上较易于实现，但要把握住今后普及的关键问题，一旦标准化过了头，就完全失去了原来的优点。
This article mainly introduces the major semiconductor companies and installation companies in Japan are competing to develop a small shell (CSP: chipsizepackage or ChipscalePackage) almost the same size as u1 chip. Some of them have started to sell samples of the same size as QFP with the same number of pins, only 1/10 that much, and also can be multi-pin, which will play a role in the development of high-speed LSI Great role in promoting. Especially in the 10o pin ~ 200 pin for the development goals, is developing and producing all-in-one telephone and camera VTR company has aroused great interest. Although standardization, cost and installation are easier to implement, it is absolutely necessary to grasp the key issues popularized in the future. Once the standardization is over, the original advantages are completely lost.