IBM新“Air-Gap”技术采用真空作为低介电常数材料真空管从计算机中已消失了数十年,但如今真空却做出令人吃惊的反击。IBM推出一新半导体制造技术,该技术通过“空气隙”(Air-Gap,实际是微小的真空洞)来替换集成电路中铜线附近的常规绝缘材料。初步结果显示其效果甚至比最新的固体低电介质常数材料还要好。IBM在今年5月3日宣布了其Air-Gap技术,常令人困惑的主流媒体的报道甚至是商业新闻接踵而至。一些记者抓住IBM提到了该技术采用了“自组装纳米技术”这一点,声明这些芯片实际是自我制造。实际上,“自组装”技术仅仅应用在制造过程中的 IBM’s new “Air-Gap” technology uses vacuum as a low dielectric constant material vacuum tube has disappeared from the computer for decades, but now the vacuum has made a surprising counter-attack. IBM unveiled a new semiconductor manufacturing technology that replaces conventional insulation in integrated circuits with copper through “Air-Gap” (actually a tiny vacuum hole). The preliminary results show that the effect is even better than the latest solid low dielectric constant material. IBM announced its Air-Gap technology on May 3 this year, often confusing reports of the mainstream media or even business news. Some reporters grabbed IBM and mentioned that the technology uses “self-assembled nanotechnology,” which states that the chips are actually self-made. In fact, “self-assembly ” technology is only used in the manufacturing process