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选取低Ag钎料Sn-0.3Ag-0.7Cu-0.5Bi-Ni(SACBN)与Sn-3.0Ag-0.5Cu(SAC305)做对比,采用回流炉制备SACBN与SAC305焊点,测量了SACBN和SAC305钎料的扩展率和润湿角,对SACBN进行260℃回流焊,SAC305进行250℃回流焊。对各焊点试样进行150℃下不同时间的时效处理。结果表明,SAC305焊料的扩展率为76.75%,润湿角为22.11°。SACBN焊料的扩展率为74.15%,润湿角为25.87°,两者润湿性能接近。不同时效时间下SACBN的金属间化合物(IMC)的厚度均小于SAC305,且SACBN的生长系数小于SAC305。
A comparison was made between Sn-0.3Ag-0.7Cu-0.5Bi-Ni (SACBN) and Sn-3.0Ag-0.5Cu (SAC305) with low Ag solder. SACBN and SAC305 solder joints were prepared by a reflow oven. Material expansion rate and wetting angle, SACBN 260 ℃ reflow, SAC305 250 ℃ reflow. Each welding spot sample was aged at 150 ℃ for different time. The results show that the expansion rate of SAC305 solder is 76.75% and the wetting angle is 22.11 °. SACBN solder expansion rate of 74.15%, wetting angle of 25.87 °, both close to the wetting properties. The thickness of intermetallic compound (IMC) of SACBN under different aging time was less than that of SAC305, and the growth coefficient of SACBN was less than that of SAC305.