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当封装压力传感器时,由于传感器芯片和管壳材料之间热膨胀系数的差别,在封接部位引入应力。这一封装应力引起传感器芯片硅膜
When encapsulating a pressure sensor, a stress is introduced at the seal due to the difference in coefficient of thermal expansion between the sensor chip and the package material. This package stress causes the sensor chip silicon film