罗克韦尔国际公司的工程师们成功地演示了一种高密度、高速度的电子仪器,它配有两个采用先进技术组装的军用标准处理机。这项新成果是采用薄片刻度多片组件技术将两个1750A型16位的处理机做在一起,这将在各种军事系统的电子元件组装的小型化方面起关键性作用。它可使全球定位系统地面终端、自动目标识别系统、空基与地基截击导弹、以及超级计算机等军用系统的组装向小型化和高密度化发展。使用这种多片组件技术可使组装面积缩至原来的十分之一。多片组件这种高密度技术使 Rockwell International engineers successfully demonstrated a high-density, high-speed electronic instrument equipped with two military standard processors assembled using state-of-the-art technology. The new achievement is the combination of two 1750A 16-bit processors using thin-film multi-chip component technology, which will play a key role in the miniaturization of electronic assembly for a variety of military systems. It enables the miniaturization and densification of the assembly of GPS systems such as ground-based terminals, automatic target recognition systems, ground-based and ground-based intercept missiles and supercomputers. The use of this multi-component technology can make the assembly area reduced to one-tenth. Multi-chip components make this high-density technology