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Copper nanoparticles with a size of about 150 nm were prepared in toluene using oleic acid as protecting agent. The nanoparticles were used to prepare conductive Cu ink with a polyurethane binder. Oleic acid was used to prevent the nanoparticles from oxidization and agglomeration. The prepared Cu nanoparticles were characterized by X-ray diffraction(XRD) and transmission electron microscopy(TEM). The resistivity of the copper film on glass substrate that was prepared using Cu nanoparticle ink reached about 1.5 × 10-4Ω· cm-1after it was annealed to 120 ℃. Both the nanoparticle ink and the films were characterized by XRD, fourier transform infrared(FT-IR), and the thermogravimetry-differential scanning calorimetry instrument(TG- DSC).
Copper nanoparticles with a size of about 150 nm were prepared in toluene using oleic acid as protecting agent. The nanoparticles were used to prepare conductive Cu ink with a polyurethane binder. The nanoparticles were characterized by X-ray diffraction (XRD) and transmission electron microscopy (TEM). The resistivity of the copper film on glass substrate that was prepared using Cu nanoparticle ink reached about 1.5 × 10-4Ω · cm -1 after it was annealed to Both the nanoparticle ink and the films were characterized by XRD, fourier transform infrared (FT-IR), and the thermogravimetry-differential scanning calorimetry instrument (TG-DSC).