Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding App

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To meet the processing requirements of resin transfer moulding (RTM) technology,reactive diluent containing m-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-designed molecular weights of 1500-2500 g/mol derived from 4,4\'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA),3,4\'-oxydianiline (3,4\'-ODA) and m-phenylenediamine (m-PDA).This blend shows low minimum melting viscosity (<1 Pa·s) and enlarged processing temperature window (260-361 ℃).FPI-R-1 stays below 1 Pa·s for 2 h at 270 ℃.The relationship between the molecular weight of the blend and its melting stability was first explored.Blending oligoimides with lower molecular weights exhibit better melting stability.Upon curing at 380 ℃ for 2 h,the thermosetting polyimide resin demonstrates superior heat resistance (Tg=420-426 ℃).
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