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柔性电子系统中联接电子元器件的互联金属导线多以附着在高分子基底上的薄膜形式存在.该文首先实验研究了在含糙化表面的聚酰亚胺基底上附着Cu膜的延展性能,结果显示,提高基底表面粗糙度能够显著降低Cu膜在拉伸条件下的裂纹密度.然后采用有限元方法模拟计算了基底表面糙化处理后,金属薄膜在拉伸状态下的应力分布,结果表明曲线型界面可显著改变金属薄膜在拉伸状态下的表面正应力分布,从而达到抑制金属表面裂纹的扩展以及降低裂纹密度的作用.最后,采用内聚力模型模拟膜基界面,研究了在拉伸条件下曲线型界面的损伤分布情况.结果表明,相对于平直界面,曲线型界面不易发生界面破坏.
In the flexible electronic system, the interconnected metal wires of the electronic components mostly exist in the form of thin films attached to the polymer substrate. In this paper, first, the ductility of the Cu film attached to the roughened polyimide substrate is experimentally investigated, The results show that increasing the surface roughness of the substrate can significantly reduce the crack density of the Cu film under the stretching condition.Finally, the finite element method is used to simulate the stress distribution of the metal film under tension after the substrate surface roughening treatment. The curved interface can significantly change the surface normal stress distribution of the metal film under tension, so as to inhibit the expansion of the metal surface crack and reduce the crack density.Finally, using the cohesion model to simulate the film-based interface, The results show that the interface of curve-shaped interface is less prone to interface failure than that of flat interface.