描述了能监测薄膜刻蚀的SAW器件。该器件是一种稳定的延迟线型SAW振荡器,其传播通道内涂有一层需要刻蚀的材料薄膜。去掉材料就能减小延迟线上的质量负载从而增大振荡器的频率。结果发现,75MHz的振荡器每减小1μm的膜厚,其频率就会增大690KHz以上。运用双振荡器结构就能同时监测基片温度和去掉的材料厚度。 Describes SAW devices that can be used to monitor thin-film etching. The device is a stable, delay line SAW oscillator with a thin film of material to be etched in the propagation path. Removing the material reduces the mass load on the delay line and increases the oscillator frequency. As a result, it was found that the frequency of the 75 MHz oscillator increased more than 690 KHz for every 1 μm of film thickness reduction. Dual oscillator architecture enables simultaneous monitoring of substrate temperature and material thickness removed.