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采用超声电沉积法制备了一种铜薄膜,利用浸泡腐蚀实验、电化学测试、金相显微观察和X射线衍射分析等研究了其显微组织和耐腐蚀性.结果表明:与普通电沉积铜薄膜相比,超声电沉积铜薄膜在20%HNO3溶液中开始冒气泡的时间延迟了近2倍,腐蚀速率明显降低;在3.5%NaC l溶液中自腐蚀电位明显高于普通电沉积铜薄膜,自腐蚀电流不及后者的1/2;超声电沉积铜薄膜,晶粒明显小于普通电沉积试样;(200)晶面取向明显增强,(111)衍射峰值也有所增加,(220)取向则显著减弱;从微观上解释了超声电沉积铜薄膜具有较好耐腐蚀性能的原因.
A kind of copper thin film was prepared by ultrasonic electrodeposition.The microstructure and corrosion resistance of the copper thin film were studied by immersion corrosion test, electrochemical test, metallographic observation and X-ray diffraction analysis.The results showed that compared with common electrodeposited copper thin film Compared with the electrodeposited copper thin film, the time of bubbling in the 20% HNO3 solution was nearly twice as long as that of the electrodeposited copper thin film, and the corrosion rate decreased obviously. The self-corrosion potential of 3.5% NaCl solution was obviously higher than that of the common electrodeposited copper thin film The corrosion current is less than 1/2 of that of the latter electrode. The electrodeposition of copper thin film by ultrasonic wave is obviously smaller than that of common electrodeposited sample. The orientation of (200) crystal plane is obviously enhanced, the diffraction peak of (111) is also increased, the orientation of (220) Weakened. The reason why the electrodeposited copper thin film has good corrosion resistance was explained microscopically.